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Low Profile Tactile Switch For Bluetooth Modules and Smart Devices

Model No.HX TS6675TP

In stock, shipped directly

Advantages:

  • Function: SPST-NO, momentary tactile
  • Footprint: 3.5 × 2.6 mm
  • Heights available: 1.5 / 1.8 / 2.0 mm
  • Actuation force: 150 / 230 / 320 gf
  • Rated load: 12 VDC / 50 mA
  • Compliance: RoHS / REACH

Product Specification
Product Description
Application Field
Why Choose Us

Product Description

A miniature, low‑profile SMT tactile switch tailored for Bluetooth modules and compact smart devices. Its 3.5 × 2.6 mm footprint and multiple height options deliver crisp, reliable actuation for pairing, reset, and function inputs while minimizing PCB and enclosure space. Designed for long service life with an optional IP67 sealed variant, it suits wearables, audio accessories, trackers, and IoT electronics.

Key Features

  • Compact SMT footprint: 3.5 × 2.6 mm to save PCB area
  • Low profile heights: 1.5 / 1.8 / 2.0 mm for tight enclosures
  • Actuation force options: 150 / 230 / 320 gf for tuned tactile feel
  • Electrical rating: 12 VDC / 50 mA
  • Long mechanical life: up to 1,000,000 cycles (force/height dependent)
  • Optional IP67 sealing for washability and environmental protection
  • RoHS and REACH compliant

Applications

  • Bluetooth modules: pairing, reset, mode select
  • True wireless earbuds, headsets, and BT speakers
  • Fitness bands, smartwatches, health trackers
  • Smart remotes, tags, beacons, and small IoT nodes
  • Portable audio and handheld consumer electronics

Electrical and Mechanical Specifications

  • Function: SPST-NO, momentary tactile
  • Footprint: 3.5 × 2.6 mm
  • Heights available: 1.5 / 1.8 / 2.0 mm
  • Actuation force: 150 / 230 / 320 gf
  • Rated load: 12 VDC / 50 mA
  • Mechanical life: up to 1,000,000 actuations
  • Sealing: IP67 option (sealed construction)
  • Compliance: RoHS / REACH
  • Operating mode: surface-mount, reflow compatible

Assembly and Soldering

  • Reflow soldering recommended; do not press the actuator during reflow
  • Avoid wave soldering; this is an SMT component
  • Use standard lead‑free paste and a controlled thermal profile
  • Allow components to cool before mechanical testing or enclosure assembly

PCB Layout and Stencil

  • Symmetrical pads for stable placement and consistent solder fillets
  • Keep mechanical clearance around the actuator to prevent interference with the enclosure
  • Optimized land pattern and stencil recommendations available upon request
  • CAD footprints provided for Altium, KiCad, and Eagle

Packaging

  • Supplied in ESD‑safe tape‑and‑reel for automated pick‑and‑place
  • Standard 8 mm carrier tape; typical 3,000–5,000 pcs per reel (varies by height/sealing)
  • Moisture barrier packaging available for sealed variants

Ordering Information

  • Series: LPTS‑3526
  • Height: H15 / H18 / H20 (1.5 / 1.8 / 2.0 mm)
  • Force: F150 / F230 / F320
  • Sealing: IP67 (add if sealed variant required)
  • Packaging: R (tape‑and‑reel)

Examples

  • LPTS‑3526‑H18‑F230‑R
  • LPTS‑3526‑H20‑F320‑IP67‑R

Customization

  • Alternative actuation forces or travel profiles
  • Custom height or actuator shape/color
  • Sealed/non‑sealed configurations
  • Private labeling and tailored QC/test plans

Design Resources

  • 2D drawings (PDF/DXF), 3D STEP model
  • PCB land pattern and stencil guidance
  • Reflow profile and handling notes
  • Reference PCB templates and module integration tips