XH2.5 Wire To Board Connector

The XH2.5 connector is a 2.5 mm pitch wire-to-board system offering a compact, reliable interface for low-voltage electronics. Polarized keying prevents mis-mating, and optional friction‑latch/self‑lock features improve retention in vibration or service environments. Standard through-hole headers are available in vertical (top entry) and right‑angle (side entry) styles; SMT variants are offered for reflow assembly when required.

Key features

• 2.5 mm pitch, shrouded and polarized to ensure correct mating
• Optional friction‑lock/self‑lock for secure engagement
• Header orientations: vertical and right‑angle; THT standard, SMT optional
• Complete mating set: housings, crimp terminals, headers, and custom cable harnesses
• Documentation support: 2D drawings, 3D STEP, PCB footprints, and assembly guidelines

Typical specifications (vary by supplier/series)

• Positions: 2–13 circuits
• Rated current: up to 3 A per pin (dependent on wire gauge and temperature rise)
• Rated voltage: up to 250 V AC/DC
• Contact resistance: ≤20 mΩ (typical)
• Insulation resistance: ≥1000 MΩ (typical)
• Dielectric withstand: 1000–1500 VAC for 1 minute (typical)
• Operating temperature: −25 °C to +85 °C
• Mating cycles: ≥50 (typical)

Materials and finishes

• Terminals: brass or phosphor bronze, tin plated; selective gold over nickel optional
• Housings: PA66 or PBT, natural/white as standard; UL94 V‑0 flame rating optional
• Headers: high‑temperature PA9T/LCP insulator for lead‑free soldering; matte tin over copper on solder tails

Wire side and assembly

• Crimp terminals for AWG28–22 (≈0.08–0.34 mm²); compatible with manual and automated crimp tooling
• Harness service: custom cable assemblies by pin count, wire gauge, length, color, labeling, heat‑shrink, and overmold options
• Process: THT wave/selective solder for headers; SMT versions compatible with lead‑free reflow; tape‑and‑reel with pick‑and‑place caps available for SMT

Compliance

• RoHS and REACH compliant
• Optional UL94 V‑0 housings
• Incoming inspection and test reports available on request

Typical applications

• LED lighting modules and drivers
• Consumer electronics and IoT devices
• Instrumentation, sensors, and control boards
• Small appliances, battery packs, and low‑voltage motor controllers

Ordering information (example)

• Specify: pitch/positions/header type and orientation/terminal plating/wire gauge/housing color/packaging
• Example: XH2.5‑THT‑8P V Tin Header + Matching Housing + Crimp Terminal AWG24 Tin (8‑position vertical through‑hole header with tin‑plated terminals for AWG24)