Product Description
This mid‑mount USB Type‑C receptacle sits in a PCB cut‑out so the mating interface is centered within the board thickness, reducing Z‑height and enabling slimmer enclosures and larger batteries. A reinforced metal shell with multiple SMT ground tabs improves mechanical retention and provides an effective chassis‑ground path for EMI control. The contact system implements the full 24 pins, including SuperSpeed differential pairs for USB 3.2 data rates, CC1/CC2 for cable flip and power role detection, VBUS/GND power, and SBU for accessory/Alt Modes. Gold‑plated contacts ensure stable signal integrity and long mating life; the tongue is molded from UL94V‑0, halogen‑free thermoplastic. Options such as EMI spring fingers, dust caps, and panel gaskets help mobile devices pass system‑level EMC and durability testing. Supplied in tape‑and‑reel with a pick‑and‑place cap for high‑speed SMT assembly.
Key features:
- Mid‑mount profile
- Seats in a PCB slot to lower port centerline and overall Z‑height
- Flush fit to enclosure walls for sleek industrial design
- Full Type‑C pinout (24 pins)
- USB 2.0 D+/D− plus SuperSpeed pairs for USB 3.2 data
- CC1/CC2 for orientation/PD; SBU for accessory/Alt Mode
- Power capability
- Supports USB PD negotiation; 3 A default, 5 A high‑current options
- Low contact resistance for reliable charging at higher currents
- Durability and feel
- 10,000+ mating cycles with hard‑gold contacts
- Controlled insertion/withdrawal forces per USB‑C spec
- EMI/ESD robustness
- Multiple shell ground tabs; optional EMI spring fingers
- Defined ESD shunt path to chassis ground for system‑level protection
- Mobile‑friendly construction
- Low‑profile tongue; debris‑tolerant lead‑in
- Coplanarity‑controlled SMT feet; pick‑cap for automated placement
- Materials and compliance
- UL94V‑0, halogen‑free housing; RoHS/REACH compliant
Typical specifications (verify against the specific datasheet):
- Data: USB 2.0 (480 Mbps) and USB 3.2 (up to 5 or 10 Gbps, variant‑dependent)
- Power: up to 20 V; 3 A standard, 5 A with PD/high‑current variant
- Contact resistance: ≤30 mΩ (per contact, initial)
- Insulation resistance: ≥100 MΩ (at rated conditions)
- Mating life: 10,000 cycles (typical)
- Operating temperature: −30 to +85 °C (−40 to +85 °C optional)
- Soldering: SMT reflow compatible; tape‑and‑reel packaging with pick cap
Applications:
- Smartphones and tablets
- Portable game consoles and AR/VR headsets
- Bluetooth speakers, earbuds charging cases, power banks
- Slim notebooks, 2‑in‑1s, and e‑readers
- Docking cradles, handheld scanners, and other compact consumer devices
Customization options:
- SuperSpeed capability (USB 2.0‑only or USB 3.2 Gen1/Gen2 variants)
- Contact plating thickness; shell material/finish; tongue color
- High‑current (5 A) PD variant; enhanced EMI spring fingers
- Dust cap and panel gasket options for improved debris/splash resistance (system‑level sealing required)
- Ground tab style/quantity; alignment pegs; mid‑mount depth/standoff
- Packaging: tape‑and‑reel or tray; custom pick‑cap
