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SMT Low Profile Tactile Switch For Bluetooth PCB Design

Model No.HX TS24CA

In stock, shipped directly

Advantages:

  • Contact rating (max): 12 VDC, 50 mA
  • Low‑level switching: down to 1 V, 10 µA
  • Contact resistance (initial): ≤100 mΩ
  • Insulation resistance: ≥100 MΩ at 100 VDC
  • Dielectric withstand: 100 VAC for 1 minute
  • Contact bounce: ≤5 ms (typical 1–3 ms)
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Product Specification
Product Description
Application Field
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Product Description

The MSS Mini Slide Switch is a compact, high-reliability selector designed for smart remote controls and other low‑power consumer electronics. It delivers crisp detent feedback, stable contact performance, and a low‑profile footprint that fits dense PCBs and ultra‑slim housings. Available in SPDT configurations (ON‑OFF or ON‑ON) with top or side actuation, MSS ensures intuitive user operation and long service life in everyday use.

Key Features

  • Low profile: 1.5–2.0 mm height above PCB; small footprint for dense layouts.
  • Momentary SPST‑NO contact (normally open), single pole, single throw.
  • Tactile dome for consistent feel; multiple operating force options.
  • Long mechanical life up to 1,000,000 cycles (force dependent).
  • Reflow‑solder compatible, supplied in tape & reel for automated assembly.
  • RoHS and REACH compliant; halogen‑free materials.
  • Optional sealed variant for enhanced resistance to dust and moisture.

Typical Applications

  • Bluetooth pairing and reset buttons on modules and dev boards.
  • Power/mode buttons on BLE remotes, trackers, and smart tags.
  • Earbud/charging case pairing or reset.
  • Wearable devices (bands, sensors) where low profile and reliability are critical.

Electrical Specifications

  • Contact rating (max): 12 VDC, 50 mA.
  • Low‑level switching: down to 1 V, 10 µA.
  • Contact resistance (initial): ≤100 mΩ.
  • Insulation resistance: ≥100 MΩ at 100 VDC.
  • Dielectric withstand: 100 VAC for 1 minute.
  • Contact bounce: ≤5 ms (typical 1–3 ms).

Mechanical Specifications

  • Actuation type: Momentary, tactile.
  • Operating force options: 160 gf (light), 230 gf (standard), 300 gf (firm).
  • Travel: 0.13–0.25 mm (typical ~0.15 mm).
  • Actuator: Top‑press (side‑press variant available).
  • Terminals: 4 SMT terminals (two electrically common per side).

Materials

  • Housing: High‑temperature LCP (liquid crystal polymer).
  • Dome: Stainless steel tactile dome.
  • Contacts: Copper alloy; options for silver or gold plating with nickel barrier.

Environmental

  • Operating temperature: −40 to +85°C.
  • Storage temperature: −55 to +105°C.
  • ESD immunity (typical): up to 8 kV air, 4 kV contact (system‑level performance depends on PCB design).
  • Vibration: 10–55 Hz, 1.5 mm amplitude, 2 hours per axis.
  • Shock: 100 g, 6 ms, 3 axes.
  • Optional sealing: IP‑rated variant available (consult for IP67 option).

Soldering and Assembly

  • Reflow profile: Peak 250–260°C; 20–40 seconds above 217°C; max 2 reflow cycles.
  • Wave soldering: Not recommended for SMT tactile switches.
  • Cleaning: Avoid aggressive solvents; do not immerse. Use controlled post‑reflow cleaning if required.
  • Pick‑and‑place: Use a compliant nozzle; do not actuate switch before reflow.
  • Moisture sensitivity: MSL 1 (non‑sealed); sealed variants may have higher MSL—verify per lot.

Packaging

  • Tape & reel: 8 mm embossed tape, 4,000 pcs/reel (other reel counts available).
  • Leader/trailer lengths per EIA standard; orientation arrow marked on tape.

Compliance and Safety

  • RoHS, REACH compliant; halogen‑free.
  • UL not typically required for low‑voltage signal switches; consult if needed.
  • Meets standard consumer electronics reliability tests (see Environmental section).

Design Guidelines For Bluetooth PCBs

  • Place away from RF front‑end where possible; add ground stitching via around switch to minimize ESD coupling into RF paths.
  • Use a nearby TVS diode for ESD if the switch is accessible to the user externally.
  • Implement hardware RC or firmware debouncing (e.g., 1–10 ms).
  • Employ pull‑up or pull‑down resistors matched to MCU input characteristics (typical 10–100 kΩ).
  • Maintain mechanical keep‑out around actuator for enclosure tolerances; ensure vertical actuation without lateral shear.

Notes and Cautions

  • Do not press the actuator before or during reflow; avoid over‑travel beyond rated limits.
  • Ensure flux control to prevent ingress under the dome; use appropriate solder mask design.
  • Verify enclosure clearance and button cap alignment to prevent off‑axis forces.

Availability

  • Samples and 3D models available on request.
  • Custom force/travel tuning and actuator heights available for volume programs.