Tactile Push Button Switch 4x4 5.2x5.2 J Bend SMT

This ultra‑compact, top‑actuated tactile push button switch is designed for high‑density SMT assemblies. Its J‑bend (gullwing) terminals create robust solder joints and excellent board retention while keeping a low profile. Available in 4.0×4.0 mm and 5.2×5.2 mm body sizes, it delivers a crisp, consistent click with multiple actuation force and height options. Ideal for consumer, industrial, and IoT interfaces that require reliable momentary input and fast, clean tactile response.

Key Features

• Two compact footprints: 4×4 mm and 5.2×5.2 mm
• J‑bend SMT terminals for strong solder fillets and reworkability
• SPST‑NO, momentary action with sharp tactile feedback
• Multiple forces available: 160/200/250/320 gf (±20%)
• Short travel for quick, precise actuation (typ. 0.2–0.35 mm)
• Low profile with several actuator heights for stack‑up flexibility
• Long mechanical life up to 100k–300k cycles (option‑dependent)
• Stable contact performance, low bounce time
• Heat‑resistant housing suitable for reflow soldering
• Tape‑and‑reel packaging for automated placement
• RoHS and REACH compliant

Typical Applications

• Remote controls, set‑top boxes, handheld instruments
• Wearables, IoT nodes, smart home devices
• Keypads and control panels in appliances and tools
• Test/measurement and medical disposables (non‑critical)
• Automotive interior electronics (non‑safety)

Electrical and Mechanical Specifications

• Function: SPST‑NO, momentary
• Electrical rating (resistive): up to 50 mA @ 12 VDC (consult for higher/lower level ratings)
• Contact resistance: ≤100 mΩ initial
• Insulation resistance: ≥100 MΩ @ 100 VDC
• Dielectric strength: 250 VAC, 1 minute
• Bounce time: ≤10 ms
• Actuation force options: 160/200/250/320 gf (±20%)
• Total travel: 0.2–0.35 mm (typical)
• Operating life: 100,000–300,000 cycles (depends on force/plating)
• Operating temperature: −20 to +85 °C
• Storage temperature: −40 to +85 °C

Materials and Construction

• Housing/base: heat‑resistant thermoplastic, UL94 V‑0
• Plunger/actuator: POM or equivalent engineering resin
• Snap dome: stainless steel
• Contacts: silver alloy; gold over nickel available for low‑level signals
• Terminals: copper alloy, tin‑plated (J‑bend SMT)

Footprint and Dimensions

• Body sizes: 4.0 × 4.0 mm; 5.2 × 5.2 mm
• Actuator height options: low to medium profiles available (e.g., ~1.5–5.0 mm; option‑dependent)
• Actuator diameter: ~2.0–2.5 mm (variant‑dependent)
• Terminal style: 4‑terminal, corner J‑bend gullwing
  Note: For exact land pattern, keep‑out, and height stack‑ups, request the mechanical drawing for the selected variant.

Soldering and Handling

• Reflow soldering (recommended): per JEDEC J‑STD‑020; peak 255–260 °C, time above 217 °C ≤60 s; up to 2 reflow cycles
• Hand solder: tip 350 °C max, ≤3 s per terminal; avoid mechanical stress
• Wave solder: not recommended for SMT J‑bend packages
• Cleaning: use no‑clean flux or controlled post‑reflow cleaning; prevent solvent ingress through actuator
• Do not press the actuator during pick‑and‑place or reflow; avoid over‑travel in assembly

Compliance and Quality

• RoHS and REACH compliant
• Halogen‑free options available
• Manufactured under ISO 9001 quality management

Packaging

• Tape‑and‑reel, 8 mm embossed tape with pick‑and‑place cover film
• Typical reel counts: 2,500–4,000 pcs/reel (varies by size/height)
• Bulk/tray packaging available for samples

Options and Ordering

• Body size: 4×4 mm or 5.2×5.2 mm
• Actuation force: 160/200/250/320 gf
• Actuator height: multiple low/standard/high options
• Contact plating: silver (standard) or gold over nickel (low‑level)
• Locating pegs/posts: optional
• Keycap compatibility: flat/concave caps in various colors
  Example order code (illustrative): JTS‑52‑H25‑250GF‑Ag or JTS‑40‑H20‑160GF‑Au
  Please consult the ordering guide for exact suffix definitions.

Accessories

• Snap‑on keycaps in multiple heights and colors
• Light pipes and bezels for panel alignment
• Dust covers/boots at panel level for improved contamination resistance

Design Tips

• Implement debounce (hardware RC or firmware) for 5–10 ms
• Use gold‑plated contacts for <10 mA or low‑voltage logic signals
• Provide an external over‑travel stop in the keycap/panel to protect the dome
• Balance pad sizes and use solder‑mask‑defined (SMD) pads to control solder wicking on J‑bend leads
• Minimize side‑loads from the key mechanism; ensure perpendicular actuation

Notes

• Specifications are typical and may vary with selected options. For guaranteed limits, recommended land pattern, 3D CAD, and reliability data, request the latest datasheet for the exact 4×4 or 5.2×5.2 J‑bend SMT variant.