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Switch For PCB

Model No.HX TS365Z2J

In stock, shipped directly

Advantages:

  • Contact bounce: ≤5 ms typical
  • Dielectric strength: 250 VAC for 1 minute
  • Insulation resistance: ≥100 MΩ @ 100 VDC
  • Contact resistance: ≤100 mΩ initial, ≤200 mΩ over life
  • Contact arrangement: SPST-NO, single pole
  • Actuation travel: 0.25–0.5 mm

Product Specification
Product Description
Application Field
Why Choose Us

Product Description

Compact, low-profile push button switch designed for direct PCB mounting. Offers crisp tactile feedback, reliable lifecycle, and options for surface-mount (SMD) or through-hole (THT). Ideal for user input, reset/boot, calibration, and mode selection in space-constrained electronics.

Key Features

  • Function: SPST-NO, momentary (push-to-make)
  • Mounting: SMD gull-wing or THT 4-pin
  • Rating: 50–100 mA at up to 12 VDC (resistive); logic-level compatible
  • Tactile feel: defined click; multiple operating force options
  • Travel: short stroke for fast actuation (0.25–0.5 mm)
  • Lifecycle: up to 1,000,000 actuations, depending on force/model
  • Sealing: top-sealed washable variants; optional IP67 sealed versions
  • High-temperature housing for SMT reflow; UL94 V-0 plastics
  • Footprints: 4.5×4.5 mm, 6×6 mm, 7×7 mm bodies; heights 1.5–7.0 mm
  • Packaging: tape & reel for SMD; bulk/ammo for THT
  • Compliance: RoHS, REACH, halogen-free

Typical Applications

  • Consumer electronics and IoT nodes
  • Industrial control and HMI boards
  • Telecom modules and network devices
  • Automotive electronics (non-safety, interior modules)
  • Wearables and medical instrumentation (non-life critical)
  • Development boards: reset, boot, user buttons

Electrical Specifications

  • Contact arrangement: SPST-NO, single pole
  • Electrical rating: 50 mA @ 12 VDC standard; 1–100 mA @ 3.3/5 V logic
  • Contact resistance: ≤100 mΩ initial, ≤200 mΩ over life
  • Insulation resistance: ≥100 MΩ @ 100 VDC
  • Dielectric strength: 250 VAC for 1 minute
  • Contact bounce: ≤5 ms typical
  • ESD withstand (sealed models): ±8 kV air, ±4 kV contact

Mechanical Specifications

  • Actuation travel: 0.25–0.5 mm
  • Operating force options: 130 gf, 160 gf, 260 gf, 320 gf
  • Release force: ≥30 gf
  • Actuator styles: round or square; optional colored caps
  • Lifecycle: 100,000 to 1,000,000 cycles (model dependent)
  • Terminals: copper alloy, Sn or SnAgCu finish

Environmental Ratings

  • Operating temperature: -40 to +85°C (up to +105°C optional)
  • Storage temperature: -55 to +125°C
  • Humidity: 0–95% RH, non-condensing
  • IP rating: top-sealed washable; IP67 optional on sealed variants
  • Vibration: 10–55 Hz, 1.5 mm p-p
  • Mechanical shock: 100 g, 6 ms

Materials and Compliance

  • Contacts: silver alloy or gold-plated dome (low-level signal options)
  • Housing: high-temperature thermoplastic, UL94 V-0
  • Actuator/cap: POM or PC
  • Terminals: copper alloy, tin-plated
  • Compliance: RoHS, REACH, halogen-free
  • Lead-free solder compatibility: yes

Dimensions and PCB Footprints

  • Common body sizes: 4.5×4.5 mm, 6×6 mm, 7×7 mm
  • Heights: 1.5–7.0 mm options (low-profile to tall)
  • Pin pitch: 3.5–5.0 mm
  • SMD recommended pads (typical 6×6 body): 1.2×1.4 mm pads, 3.5 mm spacing; keepout around actuator ≥3.0 mm diameter
  • THT hole size: 1.0 mm plated-through holes for 6×6 grid; hole-to-hole spacing per body size
  • Clearance: ensure 7–10 mm vertical clearance if using caps or tall actuators

Mounting and Assembly

  • SMT reflow profile: preheat 150–180°C for 60–120 s; peak 240–250°C ≤10 s; up to 3 reflow cycles
  • Hand soldering: 350°C tip, ≤3 s per pin; avoid prolonged heat on actuator
  • Wave soldering: suitable for THT versions; SMD not recommended
  • Cleaning: use only on top-sealed/washable models; avoid solvent ingress; ultrasonic cleaning not recommended for unsealed
  • Placement: pick-and-place with vacuum cap or pick-up tape; verify actuator free movement post-reflow

Electrical Integration

  • Pin usage: two diagonally opposite pins are the switching contacts; remaining pins provide mechanical stability or redundant connection
  • Debounce: implement RC or firmware debounce (5–20 ms typical)
  • ESD protection: place TVS near MCU or route to chassis/ground; follow good grounding practices
  • EMC: keep high-speed traces away from switch; provide ground pour under body where feasible

Options and Variants

  • Mounting: SMD or THT
  • Body sizes/heights: multiple footprints and profiles
  • Operating force: 130/160/260/320 gf
  • Contact plating: silver standard; gold for low-level signals
  • Sealing: standard, top-sealed washable, IP67 sealed
  • Actuator/caps: assorted colors, low/high profile, long-stem for panel-through PCB
  • Metal frame or shielded versions for enhanced tactile feel

Quality and Testing

  • Solderability per J-STD-002
  • Moisture sensitivity level: MSL 1–3 (model dependent)
  • Lifecycle tested to stated cycles
  • Sampling tactile feel verification
  • Packaging per EIA-481 (tape & reel)

Packaging

  • SMD: tape & reel (7" or 13" reels; typical 2,000–4,000 pcs/reel)
  • THT: bulk, ammo pack, or tray
  • Marking: lot/date code for traceability

Ordering Information

  • Series: PCB Tact Switch
  • Mounting: SMD or THT
  • Body size: 4.5 / 6.0 / 7.0 mm
  • Height: specify 1.5–7.0 mm
  • Operating force: 130 / 160 / 260 / 320 gf
  • Contact finish: Ag or Au
  • Sealing: standard / top-sealed / IP67
  • Example part code: TSW-6x6-SMD-3.5H-260gf-TS-Au
  • MOQ: SMD typically 3,000 pcs; THT typically 500 pcs (may vary by variant)

Lead Time and Warranty

  • Lead time: 2–4 weeks standard; expedited options available
  • Warranty: 12 months against manufacturing defects

Installation Notes and Best Practices

  • Press actuator perpendicular; avoid side-loading to prevent premature wear
  • Do not exceed electrical ratings; for higher currents use panel-grade pushbuttons
  • Use caps to improve ergonomics and visibility
  • Maintain adequate creepage/clearance to nearby high-voltage nets
  • Observe ESD handling rules; store sealed models in dry-pack if specified
  • Validate tactile feel and reflow profile on your actual PCB before mass production