Mini SMD Tactile Switch For Wireless Communication Devices

Ultra‑compact, low‑profile momentary tactile switch designed for space‑constrained wireless communication devices. Optimized for pairing, reset, power, and mode selection functions in RF modules, smartphones, wearables, IoT nodes, routers, and headsets. Stable contact performance with low bounce to minimize signal disturbances in sensitive electronics. Surface‑mount, reflow‑solderable construction for high‑volume automated assembly

Key Features

• Compact footprint: approximately 3.0 × 2.0 × 1.5 mm (L × W × H)
• Top‑actuated, SPST‑NO (normally open) contact configuration
• Multiple operating force options (typical: 130 gf, 180 gf, 260 gf) to suit different HMI requirements
• Short travel for crisp tactile feedback (typical: 0.15 mm)
• Long mechanical life up to 300,000 cycles (depending on force option)
• Low contact bounce (≤10 ms) for clean signal input
• Lead‑free, halogen‑free, RoHS and REACH compliant
• Delivered in tape‑and‑reel for automated pick‑and‑place

Typical Applications

• Wireless pairing or reset button on RF transceiver modules
• Mode/power selection on Bluetooth, Wi‑Fi, and LPWAN devices
• User input on smartphones, feature phones, TWS charging cases, and wearables
• Control keys on routers, gateways, remote controls, and handheld terminals
• Compact IoT sensors and data loggers

Technical Specifications

• Contact arrangement: SPST‑NO, momentary
• Electrical rating: 12 VDC, 50 mA (max)
• Contact resistance: ≤100 mΩ (initial), ≤200 mΩ (after life test)
• Insulation resistance: ≥100 MΩ at 100 VDC
• Dielectric withstanding voltage: 100 VAC for 1 minute
• Bounce time: ≤10 ms
• Operating force: 130 / 180 / 260 gf (variants)
• Total travel: 0.15 ± 0.05 mm
• Operating life: up to 300,000 actuations (force‑dependent)
• Operating temperature: −40°C to +85°C
• Storage temperature: −40°C to +85°C
• Actuation type: top push
• Mounting: SMD, gull‑wing terminals
• Environmental sealing: dust‑resistant (not waterproof; typical IP40)

Materials

• Housing: high‑temperature LCP or equivalent
• Actuator: engineering thermoplastic (e.g., PA66)
• Contacts: copper alloy with Ag over Ni or Au over Ni plating (variant‑dependent)
• Terminals: copper alloy, matte Sn over Ni

Mechanical Outline

• Body size: approx. 3.0 mm (L) × 2.0 mm (W)
• Height: approx. 1.5 mm (including actuator)
• Terminal style: 2 or 4 gull‑wing leads (depending on variant)
• Orientation: center top actuator

Recommended PCB Land Pattern

• Pad size: ~1.0–1.2 mm × 0.6–0.8 mm (per terminal)
• Pad spacing: designed to match the terminal pitch of the selected variant
• Solder mask and stencil: optimize for fine‑pitch SMD; consult assembly guidelines

Soldering and Reflow Profile

• Preheat: 150–180°C for 60–120 s
• Reflow peak: 245–255°C, max 10 s at peak
• Time above 217°C: ≤40 s
• Number of reflow cycles: up to 2
• Hand soldering: not recommended due to small size; if necessary, use controlled low‑temperature techniques

Reliability and Testing

• Mechanical endurance: up to 300k cycles (per variant)
• Vibration/impact: suitable for portable device assembly; verify in application
• Thermal cycling: qualified across −40 to +85°C range
• Salt spray/corrosion: plated terminals for standard SMT environments (not for harsh outdoor exposure without enclosure)

Compliance

• RoHS compliant (lead‑free)
• REACH compliant
• Halogen‑free
• No UL recognition typically required for low‑voltage HMI switches (verify project needs)

Packaging

• Tape‑and‑reel per EIA standard for automated pick‑and‑place
• Reel size: 8 mm tape, 4,000 pcs/reel (typical; may vary by variant)
• Moisture sensitivity: MSL 1–2 (check specific variant label); store sealed and dry

Ordering Information

• Type: Mini SMD tactile switch, top push, SPST‑NO
• Operating force options: 130 gf / 180 gf / 260 gf
• Height options: standard low profile (~1.5 mm); other heights available by variant
• Plating options: Ag‑plated or Au‑plated contacts
• Example part code format: MSTS‑3020‑F180‑LP (series‑size‑force‑low profile)
• Include packaging suffix for tape‑and‑reel when ordering high volumes

Benefits for Wireless Devices

• Saves PCB space and enables thinner device profiles
• Clean, reliable user input with low electrical noise
• Robust enough for frequent use cases like pairing/reset
• Simplifies mass production with SMT and standard reflow compatibility

Notes

• Specifications are typical and may vary by exact variant; always verify with the product datasheet and perform application‑level validation.
• For waterproof or higher temperature requirements, select a sealed or high‑temp variant specifically rated for those conditions.