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EH2.54 Surface Mount Wire To Board Connector SMT

Model No.:HX 2.0-9P LTDK

In stock, shipped directly

Advantages:

  • Positions: 2–12 pins
  • Rated voltage: up to 250 V AC/DC
  • Contact resistance: ≤20 mΩ (typical)
  • Insulation resistance: ≥1000 MΩ (typical)
  • Mating cycles: ≥50 (typical)

Product Specification
Product Description
Application Field
Why Choose Us

Product Description

The EH2.54 SMT connector is a 2.54 mm pitch wire-to-board solution designed for reflow assembly, pairing crimped wire housings with surface-mount board headers. Polarized keying and optional friction-latch/self-lock features prevent mis‑mating and accidental unplugging, making it suited to compact electronics that require reliable, serviceable connections.

Key features

  • 2.54 mm pitch for robust, easy routing on standard PCBs
  • Polarized housing; friction lock/self‑lock options for secure retention
  • Vertical (top entry) and right‑angle (side entry) SMT headers
  • Reflow‑capable insulators; pick‑and‑place caps and tape‑and‑reel packaging available
  • Complete ecosystem: plug housings, crimp terminals, matching SMT/THT headers, and custom cable harnesses

Typical specifications (values vary by supplier/series)

  • Positions: 2–12 pins
  • Rated current: up to 3 A per pin (depends on wire gauge and temperature rise)
  • Rated voltage: up to 250 V AC/DC
  • Contact resistance: ≤20 mΩ (typical)
  • Insulation resistance: ≥1000 MΩ (typical)
  • Dielectric withstand: 1000–1500 VAC for 1 min (typical)
  • Operating temperature: −25 °C to +85 °C
  • Mating cycles: ≥50 (typical)

Materials and finishes

  • Terminals: phosphor bronze/brass, tin plated (optional selective gold over nickel)
  • Wire housings: PA66 or PBT, natural/white standard; optional UL94 V‑0
  • SMT headers: high‑temperature LCP/PA9T insulator for lead‑free reflow; matte tin over copper on solder tails

Mating, mounting, and assembly

  • Wire side: crimp terminals for AWG28–22 conductors (≈0.08–0.34 mm²); supports manual, semi‑automatic, and automatic crimp tooling
  • Board side: SMT headers in vertical or right‑angle; THT versions available for mixed assembly
  • SMT process: compatible with lead‑free reflow; packaging options include tape‑and‑reel with pick‑and‑place caps
  • Harness service: custom assemblies by pin count, wire gauge, length, labeling, heat‑shrink, and overmold as required

Compliance and documentation

  • RoHS and REACH compliant
  • Optional UL94 V‑0 flame rating for housings
  • Documentation available: 2D drawings, 3D models (STEP), PCB footprints, stencil and reflow guidelines, crimping specifications, and incoming inspection reports

Typical applications

  • Consumer electronics, IoT and smart home devices
  • LED lighting strips and drivers
  • Instrumentation, sensors, and control modules
  • Small appliances, battery packs, and low‑voltage motor controllers

Ordering information (example)

  • Specify: pitch/positions/header orientation/terminal plating/wire gauge/housing color/packaging
  • Example: EH2.54‑SMT‑8P RA Tin Header + Matching Housing + Crimp Terminal AWG24 Tin (8‑position right‑angle SMT header with tin‑plated terminals for AWG24)