Product Description
This 6‑pin vertical SMT connector series is designed for compact consumer electronics that need robust board‑to‑board or wire‑to‑board links with fast, automated assembly. Available in common pitches (1.0/1.25/2.0/2.54 mm), it balances footprint efficiency with current‑carrying capability. A high‑temperature UL94V‑0 housing supports lead‑free reflow, while reinforced solder tabs and optional locating pegs improve mechanical stability against drop and vibration. Shrouded options with polarization and friction latch reduce mis‑mating and provide a secure connection. Contacts use phosphor bronze with tin or hard‑gold over nickel to achieve low contact resistance and long‑term reliability. Supplied in tape‑and‑reel with pick‑and‑place caps for high‑speed SMT.
Key features:
- Compact footprint with vertical top entry; low mated height for slim devices
- Multiple pitch options: 1.0/1.25 mm for ultra‑compact, 2.0/2.54 mm for higher current
- Reinforced SMT hold‑downs and optional boss pegs for strong board retention
- Shrouded/unshrouded options, polarization keys, and friction latch
- High‑temperature, halogen‑free housing for lead‑free reflow
- Gold or tin contact finishes; RoHS/REACH compliant
- Delivered in tape‑and‑reel with pick cap for automated placement
Typical specifications (verify per selected part number/datasheet):
- Pin count: 6
- Orientation: Vertical (top entry)
- Pitch options:
- 1.0–1.25 mm: current up to 1.0 A per pin (30 °C temp rise, 2 pins powered adjacent)
- 2.0 mm: up to 2.0 A per pin (derate for all‑pins powered)
- 2.54 mm: up to 3.0 A per pin (derate per thermal conditions)
- Voltage rating (by pitch and creepage): 100 VAC/DC typical for ≤1.25 mm; up to 250 VAC/DC for 2.54 mm
- Contact resistance: ≤20–30 mΩ initial
- Insulation resistance: ≥1,000 MΩ at 500 VDC
- Dielectric withstand: 800–1,000 VAC, 1 min
- Mating cycles: 30–50 cycles typical (gold‑flash or selective gold options available)
- Operating temperature: −40 to +85 °C (to +105 °C optional)
- Coplanarity (SMT leads): ≤0.10 mm
- Materials: Contacts—phosphor bronze, Ni underplate with Sn or Au finish; Housing—LCP/PA9T UL94V‑0
- Soldering: Lead‑free reflow, 260 °C peak; MSL 1 typical
Applications:
- Earbuds/charging cases, wearables, handhelds, smart speakers, soundbars, TVs/monitors
- Set‑top boxes, game accessories, toys and educational kits
- Home IoT hubs, smart thermostats, small appliances, drones, portable instruments
- Docking interfaces, daughterboard links, sensor and control boards
Customization options:
- Pitch and stack height; shrouded vs. unshrouded; polarization keying and latch style
- Contact plating (full tin, selective gold, hard gold), plating thickness
- SMT hold‑down style, locating pegs, boss dimensions; housing color and marking
- Matching crimp housings/terminals or mating headers; keying variants
- Packaging: tape‑and‑reel with pick cap or tray
Design notes:
- Follow recommended pad layout and keep‑out for housing walls and latch
- Derate current per ambient temperature, trace width, and pin population
- Place stitching vias near hold‑downs for better peel‑off resistance
- Use selective gold on mating area for improved cycle life in frequent‑mate applications
